ORACLE® 270-7806-01 TTV:
In situ thermal resistance tester for determining comparative TIM thermal performance in “real world” integrated circuits.
The c (TTV) is used to provide thermal resistance on a device that is closer to real-world applications. It consists of a ca. 1” x 1” bare silicone die and a copper heat sink. The copper heat sink has an embedded T type thermocouple that measures the temperature of the heat sink. The silicone die has 34 thermal sensors across the area of a die that measure the resistance in response to the buildup of heat. 0.5 grams of thermal grease when applied between the die and heat sink and a uniform power is supplied across the die. The resistances of an area on the die and the heat sink temperature are recorded after the power is applied and temperature equilibrium is established. The temperatures and resistances are recorded in an Excel file as shown.
The average temperature of a specific area on the die corresponding to an average resistance measurement is determined using a calibration chart. The chart is developed from die resistances recorded at a number of set temperatures as shown below.
The power supplied to the TTV is also carefully recorded. The resistance is determined using the fundamental equation (Tr –Ths)/ P