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AOS Non-Silicone
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Micro-Faze® A
Micro-Faze® K
Sure-Form®
Silicone vs. Non-Silicone
Thermal Resistance
Thermal Conductivity
Operating Temperature
Sprayable Thermal Grease

Technical Data Sheet*
AOS MICRO-FAZE® A
Dry Film Interface Material

(Not a phase-change material)
Product Code: 52046
View Pdf Version

Product Description

MICRO-FAZE® A is a new, revolutionary thermal interface film formulated with non-silicone thermal grease. It was developed by AOS to offer the lowest thermal resistance in a thermal interface without the mess of grease. MICRO-FAZE A is a die-cut aluminum foil substrate coated on both sides with specially formulated thermal grease that is naturally tacky but dry to the touch. MICRO-FAZE A is non-wax-based and offers unique heat transfer properties.

Easy to Use

Attach ordinary Scotch tape
to the protective layer for
easy peal away.

Peel off front
and back layers

Ready to use


Product Features & Benefits

MICRO-FAZE A retains all the unique advantages of thermal grease but in the form of a thermal interface film.

MICRO-FAZE A requires minimum force to achieve total interface contact.

MICRO-FAZE A allows for total "wetting action" to fill all microscopic surface voids without changing phase.

A positive coefficient of thermal expansion (CTE) increases the wetting action for total interface contact.

Heat transfer takes place at any temperature (unlike phase change materials), making MICRO-FAZE A an excellent choice for cold plate applications.

MICRO-FAZE A offers maximum heat transfer capability for power components.

MICRO-FAZE A is an excellent replacement for phase change materials and silicone pads.

MICRO-FAZE A is a "drop-in-place" product that is easy to use and handle in a manufacturing environment.

MICRO-FAZE A is naturally tacky - no adhesive, fiberglass or other non-conductive material is used that may penalize thermal resistance.

MICRO-FAZE A microscopically changes to fill all microscopic voids on part surfaces.

MICRO-FAZE A's thixotropic nature prevents run out.

Major Applications

Power modules, IGBTs, DC-DC converter modules, solid state relays, diodes, power mosfets, RF components and thermoelectric modules.

Microprocessors, multichip modules, ASICs and other digital components.

Power amplifiers, large area applications for power supplies and other custom enclosure heat dissipating surfaces.

Available Configurations

MICRO-FAZE A is available in rolls and can be die-cut to your exact specifications.

Typical Properties

Physical Properties A4 A6
Substrate Aluminum Aluminum
Substrate Thickness, in. 0.002 0.002
Compound Thickness/side in. 0.001 0.002
Total Thickness, in. 0.004 0.006
Thermal Properties
Thermal Resistance, °C in2/W
(ASTM D-5470 modified)
0.018 0.02

* Preliminary Technical Data Sheet
Micro-Faze® is a registered trademark of AOS Thermal Compounds.

 

AOS Thermal Compounds
22 Meridian Road, Suite #6, Eatontown, NJ 07724
phone (732)389-5514 | fax (732)389-6380

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