Product Description
Since developing the first non-silicone thermal gease for AT&T in the early 1970’s, AOS has continued to develop and expand the widest offering of silicone-fee thermal greases on the market, all with a design toward ease of use and durability. There is no silver bullet thermal grease that is ideal for every application. This is why we offer such a wide variety fom low resistance thin bond line products, to high thermal conductivity greases for thick film applications. Typical properties can include water cleanability, thixotropic or Newtonian rheology, customized rheology, little to no pump-out, low outgassing,
and high temperature stability.
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Features and Benefits
- Non-silicone; non-curing
- Resists pump-out
- Water cleanable; no mess, no solvents
- Excellent wetting
- Low bond line for lowest resistance
- High thermal conductivity for thick film
- High dielectric strength
- Non-hazardous; biodegradeable
- RoHS and REACH compliant
- Customized rheology
Samples After Thermal Shock Stability (0—165˚C @ 10 min Dwell)
• SURE-FORM 52153 unchanged
• Silicone Putty—Fluid bleed and slump
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