Suggested Applications

SURE-FORM's highly conformable nature allows the pad to fill all voids between a heat generating device and heat sink metal chassis.

Non-Silicone formula is advantageous for optical applications and high compression loads.
SURE-FORM conducts heat away from individual components and into metal covers, frames or spreader plates.

SURE-FORM offers unique advantages in applications such as microprocessors, cache chips, heat pipe interposer plates, laptop PCs, high-density handheld portable electronics, electronic ballasts & various automotive applications.