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AOS Non-Silicone AOS Silicone ![]() Micro-Faze® A Micro-Faze® K Sure-Form® Silicone vs. Non-Silicone Thermal Resistance Thermal Conductivity Operating Temperature Sprayable Thermal Grease |
Technical Data Sheet* Product Description Product Features & Benefits SURE-FORM retains all the unique advantages of thermal grease but in the form of a gap filler material. SURE-FORM is a highly conformable, soft, naturally tacky gap filling material for use in applications where minimum stress is placed on components. SURE-FORM will conform to any shape and/or size of a component enabling complete physical contact, so as to minimize the resistance to heat flow and to achieve the best thermally conductive path. The natural tackiness of SURE-FORM allows two surfaces to be in contact with minimum pressure. Available Configurations SURE-FORM is available in sheets and can be die-cut to exact specifications ranging in thickness from 0.08" (2mm) and higher. The product is also available in standard grease form. Major Applications SURE-FORM's highly conformable nature allows the pad to fill all voids between a heat generating device and heat sink metal chassis. Non-Silicone formula is advantageous for optical applications and high compression loads. SURE-FORM conducts heat away from individual components and into metal covers, frames or spreader plates. SURE-FORM offers unique advantages in applications such as microprocessors, cache chips, heat pipe interposer plates, laptop PCs, high-density handheld portable electronics, electronic ballasts & various automotive applications. Typical Properties
* Preliminary Technical Data Sheet
AOS Thermal Compounds 22 Meridian Road, Suite #6, Eatontown, NJ 07724 phone (732)389-5514 | fax (732)389-6380 Click to Request More Information |
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