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AOS Non-Silicone
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Micro-Faze® A
Micro-Faze® K
Sure-Form®
Silicone vs. Non-Silicone
Thermal Resistance
Thermal Conductivity
Operating Temperature
Sprayable Thermal Grease

Technical Data Sheet*
AOS SURE-FORM®
Gap Filler Material

Product Code: 52042
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Product Description

SURE-FORM® Non-Silicone Thermally Conductive Gap Filler was developed by AOS in response to the growing demand in electronics for increased thermal transfer efficiency in applications where surface textures vary and the space between surfaces is uneven. SURE-FORM is highly conformable and is an excellent replacement for silicone elastomer gap fillers, which require significant pressure to achieve 100 percent surface contact. SURE-FORM is easy to use and offers all the benefits and performance of thermal grease without the limitations in application and handling.

Product Features & Benefits

SURE-FORM retains all the unique advantages of thermal grease but in the form of a gap filler material.

SURE-FORM is a highly conformable, soft, naturally tacky gap filling material for use in applications where minimum stress is placed on components.

SURE-FORM will conform to any shape and/or size of a component enabling complete physical contact, so as to minimize the resistance to heat flow and to achieve the best thermally conductive path.

The natural tackiness of SURE-FORM allows two surfaces to be in contact with minimum pressure.

Available Configurations

SURE-FORM is available in sheets and can be die-cut to exact specifications ranging in thickness from 0.08" (2mm) and higher. The product is also available in standard grease form.

Major Applications

SURE-FORM's highly conformable nature allows the pad to fill all voids between a heat generating device and heat sink metal chassis.

Non-Silicone formula is advantageous for optical applications and high compression loads.

SURE-FORM conducts heat away from individual components and into metal covers, frames or spreader plates.

SURE-FORM offers unique advantages in applications such as microprocessors, cache chips, heat pipe interposer plates, laptop PCs, high-density handheld portable electronics, electronic ballasts & various automotive applications.

Typical Properties

Property Value Test Method
Composition Non-Silicone  
Color Gray  
Density 2.8 ASTM D-70
Thickness, inch (mm) 0.08(2mm) & up  
Operating Temperature Range -40°C to 150°C  
Thermal Conductivity, W/m°K 1.68 ASTM E-1530
Thermal Resistance, °C-in2/w/mil 0.03  
Coefficient of Thermal Expansion 31.8x10-6/°C  
Dielectric Strength, V/mil 318 ASTM D-149
Volume Resistivity, ohm-cm 2.15x1015 ASTM D-257

* Preliminary Technical Data Sheet
Sure-Form® is a registered trademark of AOS Thermal Compounds.

 

AOS Thermal Compounds
22 Meridian Road, Suite #6, Eatontown, NJ 07724
phone (732)389-5514 | fax (732)389-6380

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