Micro-Faze 3A4 – 12 x 12 inch

$39.00

MICRO-FAZE® 3A4 is a revolutionary new thermal interface film formulated with non-silicone thermal grease. It was developed by AOS to offer the lowest
thermal resistance in a thermal interface without the mess of grease. MICRO-FAZE 3A4 is a die-cut aluminum foil substrate coated on both sides with specially formulated thermal grease that is naturally tacky but dry to the touch. MICRO-FAZE 3A4 is non-wax-based and offers unique heat transfer properties.

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Description

MICRO-FAZE® 3A4 is a revolutionary new thermal interface film formulated with non-silicone thermal grease. It was developed by AOS to offer the lowest
thermal resistance in a thermal interface without the mess of grease. MICRO-FAZE 3A4 is a die-cut aluminum foil substrate coated on both sides with specially formulated thermal grease that is naturally tacky but dry to the touch. MICRO-FAZE 3A4 is non-wax-based and offers unique heat transfer properties.

Product Features & Benefits

MICRO-FAZE 3A4 retains all the unique advantages of thermal grease but in the form of a thermal interface film.

  • Minimum force is required to achieve total interface contact.
  • MICRO-FAZE allows for total “wetting action” to fill all microscopic surface voids without changing phase.
  • Unlike phase change materials, heat transfer starts at 25ºC or lower, making MICRO-FAZE 3A4 an excellent choice for cold plate applications.
  • Offers maximum heat transfer capability for power components.
  • Excellent replacement for phase change materials and silicone pads.
  • MICRO-FAZE 3A4 is a “drop-in-place” product that is easy to use and handle in a manufacturing environment.
  • Naturally tacky – no adhesive, fiberglass, or other non-conductive material is used that may reduce thermal resistance.
  • Microscopically changes to fill all microscopic voids on part surfaces.
  • Thixotropic nature prevents run out.

Major Applications

  • Power modules, IGBTs, DC-DC converter modules, solid state relays, diodes, power MOSFETs, RF components and thermoelectric modules.
  • Microprocessors, multichip modules, ASICs and other digital components.
  • Power amplifiers, large area applications for power supplies and other custom enclosure heat dissipating surfaces.