52055KD – 1 oz Syringe
$26.50
AOS 340 WC (Water Cleanable) 52055 is a non-silicone based thermal grease developed to replace all general purpose silicone and non-silicone thermal greases. 52055 has twice the conductivity of standard thermal greases, but more importantly, it will spread into a very thin bond line for extremely low thermal resistance. 52055 also resists pump-out, more than typical thermal greases, and despite the increased reliability and durability, it cleans up with only water.
Description
AOS 340 WC (Water Cleanable) 52055 is a non-silicone based thermal grease developed to replace all general purpose silicone and non-silicone thermal greases. 52055 has twice the conductivity of standard thermal greases, but more importantly, it will spread into a very thin bond line for extremely low thermal resistance. 52055 also resists pump-out, more than typical thermal greases, and despite the increased reliability and durability, it cleans up with only water.
The Non-Silicone Advantage
Silicone-based compounds have an undesirable tendency to physically migrate and contaminate components nearby. This interferes with circuit operation long after hardware installation to cause unexpected, untimely, and often inaccessible problems. The AOS Heat Sink Compound’s no creep feature extends circuit life by protecting components longer and by eliminating premature failure of adjacent components caused by migrating silicone base fluid.
Product Features & Benefits
AOS 340 WC is non-silicone based, non-reactive, and non-abrasive with a soft, grease-like consistency, thixotropic behavior and excellent dielectric properties. The thermal performance of 52055 is better than standard heat sink compounds and even most premium thermal greases on the market.
Major Applications
AOS 340 WC is designed to be applied where thermal coupling is required and where a device may need to be removed from the heat sink later. Major applications include power transistors, diodes, and silicone control rectifiers. It is also an effective thermal joint compound for any device where efficient cooling is desired.