53053JO – 4 oz Jar
$49.00
AOS Sure-Form 53 is a dispensable, one-part, non-silicone gap filler. This product is very tacky, resists vibration and shock, will stay in place and not run, even under elevated use temperatures. This product is very viscous. The initial yield point is very high. The material will flow under higher shear and tends to increase in viscosity slightly over time. This solid is able to withstand temperatures in excess of 180 oC for short periods of time. Sure-Form 53 was developed by AOS in response for a moderately priced product that adheres very well initially and stays put in place while still providing increased thermal transfer efficiency. The material appears compatible with most electronic materials. The material does not phase separate.
Description
AOS Sure-Form 53 is a dispensable, one-part, non-silicone gap filler. This product is very tacky, resists vibration and shock, will stay in place and not run, even under elevated use temperatures. This product is very viscous. The initial yield point is very high. The material will flow under higher shear and tends to increase in viscosity slightly over time. This solid is able to withstand temperatures in excess of 180 oC for short periods of time. Sure-Form 53 was developed by AOS in response for a moderately priced product that adheres very well initially and stays put in place while still providing increased thermal transfer efficiency. The material appears compatible with most electronic materials. The material does not phase separate.
The Non-Silicone Advantage
Silicone-based compounds have an undesirable tendency to physically migrate and contaminate components nearby. This interferes with circuit operation long after hardware installation to cause unexpected, untimely and often inaccessible problems. The AOS Heat Sink Compound’s no creep feature extends circuit life by protecting components longer and by eliminating premature failure of adjacent components caused by migrating silicone base fluid.
Product Features & Benefits
Sure-Form 53 retains all the unique advantages of AOS Heat Sink Compound (Product Code: 52038) with the added benefit of higher thermal conductivity. It has a two-year minimum shelf life in its unopened container. Additional benefits include low pump-out, and high thermal conductivity over a wide operating temperature range.
Sure-Form 53 is a much more cost-effective gap filling solution compared to pre-formed gap pads. The product has considerably greater thermal conductivity than our standard non-silicone thermal grease, and can be modified by customer request.