53054KD – 1 oz Syringe
$27.75
AOS 340 LR (lowest resistance) is a non-silicone thermal grease with the current lowest thermal resistance on the market (for thin bond line applications*). AOS 340 LR is also extremely durable and will not pump-out making it ideal for applications requiring extended life and no degradation.
* For larger gaps/thicker films use a high thermal conductivity material such as Sure-form® gap filler.
Description
AOS 340 LR (lowest resistance) is a non-silicone thermal grease with the current lowest thermal resistance on the market (for thin bond line applications*). AOS 340 LR is also extremely durable and will not pump-out making it ideal for applications requiring extended life and no degradation.
* For larger gaps/thicker films use a high thermal conductivity material such as Sure-form® gap filler.
The Non-Silicone Advantage
Silicone-based compounds have an undesirable tendency to physically migrate and contaminate components nearby. This interferes with circuit operation long after hardware installation to cause unexpected, untimely and often inaccessible problems. The AOS Heat Sink Compound’s no creep feature extends circuit life by protecting components longer and by eliminating premature failure of adjacent components caused by migrating silicone base fluid.
Product Features & Benefits
AOS 340 LR is non-silicone based, non-reactive, and non-abrasive with a soft, grease-like consistency with thixotropic behavior. It has excellent dielectric properties, lowest thermal resistance and superior durability (will not pump-out).
Major Applications
AOS 340 LR is designed to be applied where thermal coupling is required and where a device may need to be removed from the heat sink at a later time. Major applications include CPU/GPU, power semiconductors and LED’s. It is also the most efficient and cost-effective low bond line TIM 2 for use in any thermal management application.